Process capability R&D center Technical ability Supply chain management Customer focus team Quality promise

We have the leading process capability through investing on the latest Technologies and Equipment. Our delivered capability covers the smallest chip 01005, all kind of BGA, PCB size up to 550mm*480mm, 30 Layers board, POP, Flip Chip, Glue and Underfill.

We have Wave Soldering Machine for mass production, and also Selective Wave for higher standard work.

We have also Conformal Coating, Potting and etc.

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